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FOPLP也正凭借规模化优势快速崛起，被视为CoWoS的潜在继任者。FOWLP基于圆形晶圆进行封装，由于晶圆形状为圆盘状，边缘区域难以充分利用，导致芯片放置面积较小。尺寸与利用率优势是FOPLP的核心竞争力。FOPLP采用方形大尺寸面板作为载板，而非8英寸或12英寸晶圆。
。关于这个话题，51吃瓜提供了深入分析
Walmart becomes first retailer to hit $1tn market value
Luckily, with the Native AOT solution, we had a framework in place where this could be accomplished without doubling up on the amount of work required.